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[BeLight Use Case] Jumper Connection Using High-Speed Transmission FFC

High-speed communication support by replacing substrate wiring with high-speed transmission FFC.

The thermoplastic ultra-low transmission loss film "BeLight" is a product that balances low dielectric properties with high adhesion to conductors. By utilizing these features as adhesives or substrates for flat cables, it reduces the dielectric constant of the insulating parts and suppresses signal attenuation in high-frequency bands. This contributes to the realization of high-speed transmission FFCs. In this instance, we will introduce the replacement of substrate wiring with high-speed transmission FFCs and jumper connections as a case study of BeLight's application. The challenges of implementing high-speed communication using substrate wiring and the benefits of introducing jumper connections using FFCs are as follows: We are also open to discussions regarding sample provision with cables, so please feel free to contact us. 【Challenges of High-Speed Communication with Substrate Wiring】 - High cost of low dielectric substrate materials - Cases where a material change for the entire substrate is necessary - Increased design and manufacturing constraints 【Benefits of Introducing Jumper Connections】 - Reduction in the amount of expensive low dielectric substrate materials used - Increased flexibility in materials, such as utilizing general-purpose substrates (e.g., FR-4) - Reduced layout constraints of substrates due to changes in cable length - Simplification of assembly processes by adopting FFCs